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Dry etching is a method that uses gases or plasma to etch materials. It is one of the key steps in microelectronic manufacturing, primarily used to form small structures on semiconductor chips. This technique is highly valued for its precision and anisotropy, capable of fine processing at the nanoscale and creating high directional patterns perpendicular to the substrate, which is crucial for the fabrication of three-dimensional structures, such as deep holes and trenches in microelectronic devices.

Lastly, we discuss how to round the tapered holes. This step involves removing the photoresist covering the surface of the wafer, exposing the entire bare wafer to the plasma. This step uses SF6 and O2, differing from before by not including Ar gas, thus the physical bombardment effect is weaker, and it is primarily a chemical action, achieving isotropic etching to smooth sharp corners and rough sidewalls.

Now, let’s continue to explore how to create tapered holes.

In the PCB manufacturing process, the creation of tapered holes is a critical step, which involves three main stages: the fabrication of straight holes, the formation of tapered holes, and the rounding of hole corners.

Let's continue to talk about the next step: Bottom Passivation Layer Etching.

Now, let’s continue to learn about the Bosch technique.

Today, we are pushing out a new Flex-Rigid PCB with black solder mask. It also has the gold finger and immersion gold technique.

Today we will learn about the process of Bosch technique, The Bosch process is achieved through a cycle of three steps: silicon etching, sidewall and bottom passivation, and bottom passivation layer etching. These three steps form a cycle, and deep silicon etching may require multiple such cycles. First, Let’s start from silicon etching.

Last time we learned about the background and the origin of Bosch. In this article, we will learn about the etching gas SF6 and the passivation gas C4F8 in Bosch technique.

In the production and manufacturing of PCB, the "Bosch process" is a deep silicon etching technology, particularly suitable for applications such as Through-Silicon Vias (TSV) and Micro-Electro-Mechanical Systems (MEMS), which require the etching of deep holes or slots in silicon wafers. The Bosch process ensures the steepness of the sidewalls by alternating etching and passivation gases, achieving high aspect ratio structure etching. First, let’s learn about the name and background of Bosch technique.

It has been a long time since the last new product news, Here is the new product. Today we launch a new product is 4-layer high frequency high speed PCB with blue solder mask. It uses the immersion gold technique, it will also be widely used in many kinds of industrial machine.

Let's discuss three non-electrical safety clearances: the width, height, and spacing of characters, the spacing between silk screening and pads, and the 3D height and horizontal spacing in mechanical structures.