NEWS

Sanxis Tech introduces the groundbreaking 14-Layer ENIG Copper-Filled Via PCB, engineered for next-generation server systems. Utilizing Rogers F408HR high-frequency substrates with precision ENIG surface treatment, this PCB achieves >40Gbps signal transmission while solving GHz-level signal attenuation and thermal stress failures in data center infrastructure.

As technology continues to advance at a rapid pace, the demand for more compact, faster, and more efficient electronic devices has reshaped the landscape of printed circuit board (PCB) design. Among the many innovations in this space, HDI PCBs stand out as a significant evolution compared to standard PCBs. Understanding the differences between these two types of boards is crucial for engineers, designers, and businesses seeking to optimize their products for performance, reliability, and miniaturization.

As technology continues to advance, the need for smaller, faster, and more efficient electronic devices grows. One innovation playing a crucial role in meeting these demands is the HDI PCB. But what exactly is an HDI PCB, and why is it so important in modern electronics?

In the ever-evolving world of electronics design and manufacturing, the term “8 layer PCB” is generating significant buzz. As products become more complex and require higher performance standards, multi-layer PCBs have emerged as essential components in a wide range of applications—from consumer electronics to aerospace and automotive systems.

Sanxis Tech introduces its cutting-edge 6-Layer Rigid-Flex PCB engineered for next-generation electronic scanners. Combining rigid FR-4 and flexible FCCL materials, this PCB delivers unparalleled adaptability and precision for handheld devices requiring lightweight, space-efficient designs and reliable signal transmission.

Sanxis Tech unveils its groundbreaking 6-Layer Rigid-Flex PCB, engineered specifically for children’s educational electronic toys. Combining rigid FR-4 and flexible FPC materials, this PCB delivers unmatched adaptability and durability, enabling compact, lightweight designs without compromising functionality.

In the rapidly advancing world of electronics, the need for smaller, more efficient, and highly reliable circuit boards has never been greater. As devices become more compact while requiring increasingly sophisticated functionality, manufacturers are turning to High-Density Interconnect (HDI) PCBs to meet these demands. But what exactly is an HDI PCB, and why is it gaining such popularity in the electronics industry?

Sanxis Tech proudly introduces its latest breakthrough: the 8-Layer High-Temperature-Resistant Industrial Control Gold Finger PCB. Designed for extreme industrial environments, this PCB leverages advanced materials and precision engineering to deliver unmatched reliability in high-temperature, high-humidity, and high-stress applications.

In the rapidly evolving world of electronics, the demand for reliable, efficient, and precise printed circuit boards (PCBs) has never been higher. As technology continues to advance, industries such as telecommunications, automotive, consumer electronics, and medical devices require PCBs that meet the highest standards of quality and performance.

In the world of electronics and technology, communication is key. Whether it's between devices, systems, or components, effective communication ensures seamless functionality. One crucial aspect of this communication is PCB communication. But what exactly is PCB communication, and why is it so important? Let's explore this fascinating topic.

Sanxis Tech officially launched a revolutionary product for 5G communications - 6-layer 5G communication system receiver terminal PCB. Through innovative material selection and precision process design, the product can meet the critical needs of 5G base stations, industrial automation communication modules and intelligent transportation systems for high-frequency signal transmission.

Today, let’s talk about our new communication PCB for receiving AC. This PCB is made by DS7409HGB material. Its high routing density supports the complex signal receiving.