Sanxis New Product: 14-Layer ENIG Copper-Filled Via PCB (Part 28)

Sanxis Tech introduces the groundbreaking 14-Layer ENIG Copper-Filled Via PCB, engineered for next-generation server systems. Utilizing Rogers F408HR high-frequency substrates with precision ENIG surface treatment, this PCB achieves >40Gbps signal transmission while solving GHz-level signal attenuation and thermal stress failures in data center infrastructure.

 

 

Core Features: Uncompromising Signal Integrity

1. Ultra-Low Signal Loss

• High-Frequency Performance: F408HR substrate (Dk=3.3±0.05@10GHz) ensures ≤0.2dB/cm attenuation at 40GHz, fully compliant with PCIe 5.0/USB4 protocols.

2. Thermal Reliability Engineered

• Copper-Filled Vias: Conductive paste filling (resistivity ≤5μΩ·cm) withstands 1,000 thermal cycles (-55℃~125℃), reducing thermal resistance by 40%.

3. Precision Circuitry

• High-Density Design: 0.15mm/0.15mm line width/spacing supports 0.35mm BGA pitch components with wiring density of 120cm/cm².

4. EMI Defense System

 

• Active Shielding: Triple ground layers + copper vias create Faraday cage structure with >30dB EMI suppression @10GHz.

Technical Specifications 

 

Data	technical specifications
Layer	14
Material	Rogers F408HR Laminate
Thickness	1.88±0.1mm
Copper Thickness	1oz (inner/outer)
Trace Width/Spacing	0.15mm/0.15mm
Surface Treatment	ENIG
Solder Mask	Blue
Silkscreen	White

 

Applications: Powering Data-Critical Infrastructures

1. Server Motherboards: High-speed interconnects for cloud computing clusters.

2. AI Accelerator Cards: Signal layers for GPU/TPU processing units.

3. 5G Base Stations: Baseband processing units requiring 28Gbps+ transmission.

4. NVMe SSD Arrays: Enterprise storage systems with PCIe 5.0 support.

5. Data Center Switches: Backplanes for 200G/400G Ethernet solutions.

 

 

Production Excellence

Advanced Manufacturing Processes

 

• Laser Microvia Drilling: CO₂/UV hybrid drilling for 0.2mm microvias (15:1 aspect ratio).
• Copper Via Filling: Vacuum-pressure filling (>85% Cu content) with <5% voiding.
• Hybrid Impedance Control: 100Ω differential tolerance ±7% (IEEE 802.3bj compliant).
• Precision Lamination: ±25μm layer alignment with <3% Z-axis expansion.

 

Quality Assurance & Global Support

 

Sanxis Tech, with state-of-the-art facilities in Hunan and Shenzhen, offers:
● Fast Delivery: Standard products shipped within 15 days; custom designs accommodated.
● Technical Expertise: Free thermal simulation and signal integrity analysis services.
● Certifications: Compliant with ISO 9001, IATF 16949, and UL standards.

 

Ordering & Inquiries

For detailed specifications or bulk orders, visit the Sanxis Tech product page or contact our sales team directly via the "Contact Us" portal.

 

 

 

Sanxis Tech is a leading high-tech enterprise specializing in high-end PCB R&D and manufacturing. With a focus on material innovation and precision engineering, we deliver reliable solutions for industrial control, automotive electronics, and telecommunications.