Sanxis New Product: 18-Layer Heavy Copper Power PCB for Large Battery Systems

Sanxis Tech unveils the revolutionary 18-Layer Heavy Copper PCB, engineered for mega-watt battery systems. Integrating embedded copper coils and 2oz copper layers, this robust solution delivers 500A+ current capacity and ≥98% power conversion efficiency. With TG-170 high-Tg laminates and 2.5mm reinforced structure, it withstands 150°C operating temperatures and extreme industrial environments.

 

Core Features: Unmatched Power Density & Reliability

1. 500A Peak Capacityra-High Current Transmission

• 500A Peak Capacity: 2oz copper layers (70μm) support 70A continuous current per 1mm trace width, enabling 2000A/mm² current density.

2. Integrated Power Coil Technology

• Space Optimization: Embedded spiral copper coils (0.2mm spacing) reduce external wiring by 60%, tripling power density.

3. Extreme Thermal Resilience

• 170°C Stability: TG-170 substrate maintains structural integrity at 170°C Tg, with CTE <3% during 260°C reflow.

4. EMI & Arc Protection

 

• Industrial Safety: 4 shielding layers suppress EMI to <30dBμV/m @30MHz (CISPR 32 Class B)
                                1.5mm creepage distance complies with IEC 60664-1 Overvoltage Category III

Technical Specifications 

 

 

Data	technical specifications
Layer	18
Material	High Tg FR-4 (TG-170)
Thickness	2.5±0.1mm
Copper Thickness	2oz (inner/outer)
Trace Width/Spacing	0.2mm/02mm
Surface Treatment	ENIG
Solder Mask	Green
Silkscreen	White

 

Applications: Powering Energy Revolution

 

1. EV Charging Stations: 500A+ DC fast-charging modules.

2. Grid-Scale Storage: 1MW+ battery management systems (BMS).

3. Industrial Motor Drives: 500kW+ variable frequency drives.

4. Renewable Inverters: Solar/wind farm power converters.

5. High-Current Busbars: Shunt resistors for energy monitoring.

 

Production Excellence

Advanced Manufacturing Processes

 

• Embedded Coil Fabrication: ±5% tolerance spiral etching with 20:1 aspect ratio.
• Heavy Copper Plating: 70μm uniform thickness (<10% variation).
• Thermal Management: 12 thermal vias/cm² (Rθja <5°C/W).
• High-Pressure Lamination: 200°C/400psi process prevents voids (<1%).

 

 

Quality Assurance & Global Support

Sanxis Tech, with state-of-the-art facilities in Hunan and Shenzhen, offers:
● Fast Delivery: Standard products shipped within 15 days; custom designs accommodated.
● Technical Expertise: Free thermal simulation and signal integrity analysis services.
● Certifications: Compliant with ISO 9001, IATF 16949, and UL standards.

 

Ordering & Inquiries

For detailed specifications or bulk orders, visit the Sanxis Tech product page or contact our sales team directly via the "Contact Us" portal.

 

 

 

 

Sanxis Tech is a leading high-tech enterprise specializing in high-end PCB R&D and manufacturing. With a focus on material innovation and precision engineering, we deliver reliable solutions for industrial control, automotive electronics, and telecommunications.