Sanxis Tech introduces the revolutionary 4-Layer Micro Module High-Speed Processor PCB, engineered for space-critical applications. Combining TG-170 high-Tg substrate with 0.13mm ultra-fine circuitry and ENIG surface finish, this 0.8mm-thin solution enables 10Gbps+ signal transmission while supporting 0.35mm-pitch BGA/CSP processors, redefining miniaturization in edge computing.
Technical Specifications
Data |
technical specifications |
Layer |
4 |
Material |
High Tg FR-4 (TG-170) |
Thickness |
0.8mm±0.1mm |
Copper Thickness |
1oz (inner/outer) |
Trace Width/Spacing |
0.13mm/0.13mm |
Surface Treatment |
ENIG |
Solder Mask |
Green |
Silkscreen |
White |
Min. Drilled Hole |
0.5mm±0.08mm |
Sanxis Tech, with state-of-the-art facilities in Hunan and Shenzhen, offers:
● Fast Delivery: Standard products shipped within 15 days; custom designs accommodated.
● Technical Expertise: Free thermal simulation and signal integrity analysis services.
● Certifications: Compliant with ISO 9001, IATF 16949, and UL standards.
Ordering & Inquiries
For detailed specifications or bulk orders, visit the Sanxis Tech product page or contact our sales team directly via the "Contact Us" portal.
Sanxis Tech is a leading high-tech enterprise specializing in high-end PCB R&D and manufacturing. With a focus on material innovation and precision engineering, we deliver reliable solutions for industrial control, automotive electronics, and telecommunications.