Company News

Sanxis New Product: 4-Layer Micro Module High-Speed Processor PCB (Part 30)

2025-07-04

二十五号品3.jpg

Sanxis Tech introduces the revolutionary 4-Layer Micro Module High-Speed Processor PCB, engineered for space-critical applications. Combining TG-170 high-Tg substrate with 0.13mm ultra-fine circuitry and ENIG surface finish, this 0.8mm-thin solution enables 10Gbps+ signal transmission while supporting 0.35mm-pitch BGA/CSP processors, redefining miniaturization in edge computing.

 

Core Features: Maximizing Performance in Minimal Space

1. Micro-Scale Integration

 

  • 50% Size Reduction: 0.13mm/0.13mm traces enable direct mounting of 0.3mm-pitch BGAs in <25mm² area.

 

2. High-Speed Signal Integrity

  • 5GHz-Optimized: Controlled 50Ω±5% impedance with <0.5dB insertion loss at 5GHz.

3. Thermal Resilience

  • Processor Protection: 24 thermal vias/cm² (0.5mm±0.08mm) under chips, θJA <15°C/W.

4. EMI Defense

  • Noise Suppression: Continuous ground planes block >25dB EMI @1GHz.

4-Layer Micro Module High-Speed Processor PCB

Technical Specifications 

 

 Data

 technical specifications

 Layer

4

 Material

High Tg FR-4 (TG-170)

 Thickness

0.8mm±0.1mm

Copper Thickness

1oz (inner/outer)

Trace Width/Spacing

0.13mm/0.13mm

Surface Treatment

ENIG

Solder Mask

Green

Silkscreen

White

Min. Drilled Hole

0.5mm±0.08mm

 

Applications: Enabling Miniaturized Innovation

iPad with 4-Layer Micro Module High-Speed Processor PCB

  1. Wearable Computing: AR glasses and health monitoring modules.
  2. IoT Gateways: Compact edge processors for smart factories.
  3. Micro-Robotics: Control units for sub-10cm³ robots.
  4. Satellite Comms: Low-earth-orbit terminal subsystems.
  5. Industrial Sensors: High-speed data acquisition controllers.

 

Production Excellence

Advanced Manufacturing Processes

  • Laser Direct Imaging (LDI): ±5μm alignment for 0.13mm traces.
  • Micro-via Filling: 100% conductive epoxy planarization.
  • Step Drilling: 0.5mm holes (±0.08mm accuracy, IPC-A-600 Class 3).
  • Neural Network AOI: 10μm defect detection resolution.

 

Quality Assurance & Global Support

4-Layer Micro Module High-Speed Processor PCB

Sanxis Tech, with state-of-the-art facilities in Hunan and Shenzhen, offers:
● Fast Delivery: Standard products shipped within 15 days; custom designs accommodated.
● Technical Expertise: Free thermal simulation and signal integrity analysis services.
● Certifications: Compliant with ISO 9001, IATF 16949, and UL standards.

 

Ordering & Inquiries

For detailed specifications or bulk orders, visit the Sanxis Tech product page or contact our sales team directly via the "Contact Us" portal.

 

 

 

 

Sanxis Tech is a leading high-tech enterprise specializing in high-end PCB R&D and manufacturing. With a focus on material innovation and precision engineering, we deliver reliable solutions for industrial control, automotive electronics, and telecommunications.