Now we will be in the heat dissipation, soldering strength, the ability to carry out electronic testing and the difficulty of the manufacture corresponding to the cost of four aspects of the immersion gold manufacture compared with other surface treatment manufacturees.
1, Heat dissipation
The thermal conductivity of gold is good, its pads made because of good thermal conductivity so that the best heat dissipation. Good heat dissipation of the PCB temperature is low, the more stable the chip work, immersed gold PCB heat dissipation is good, can be used in the Notebook PCB on the CPU bearing area, BGA type components soldering base on the comprehensive heat sink, and OSP and silver PCB heat dissipation in general.
2, Welding strength
Immersion gold PCB after three high-temperature solder joints full, OSP PCB after three high-temperature solder joints for the gray color, similar to the oxidation of the color, after three high-temperature soldering can be seen after the sinking of the gold PCB solder joints full, shiny solder good and the activity of the solder paste and flux will not affect, and the use of the OSP manufacture of the PCB card solder joints gray without luster, which affects the solder paste and the activity of the flux. Activity, easy to cause empty welding, increase the rework rate.
3, Ability to carry out electronic testing
Whether the electronic test immersion gold line PCB in the production and shipping before and after the direct measurement, the operating technology is simple, not affected by other conditions; OSP PCB due to the surface layer of organic weldable film, while the organic weldable film for the non-conductive film, so it can not be directly measured, must be measured before the OSP manufacture, but OSP is prone to micro-etching after excessive problems caused by poor soldering; silverized PCB surface for the skin film, general stability, harsh requirements on the external environment.
4, The difficulty of the manufacture corresponding to the cost
Manufacture difficulty and cost of immersion gold PCB manufacture difficulty is complex, high equipment requirements, strict environmental requirements, and because of the extensive use of gold elements, the cost of lead-free manufacture PCB in the highest; silver PCB manufacture difficulty is slightly lower, the water quality and environmental requirements are quite stringent, the cost of PCB than the immersion of gold is slightly lower; OSP PCB manufacture difficulty is the simplest, and therefore the lowest cost.
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