Today, we will push out a new HDI communication PCB, It features an advanced 8-layer HDI structure, combined with high-performance Pana M6 substrate and 2u gold plating surface treatment, ensuring excellent electrical performance and reliability.
Here is the data:
Board layer: 8 layers;
Material: Pana M6, Tg185;
Plate thickness: 1.0mm;
Copper foil thickness: inner layer 1OZ, outer layer 1OZ;
Solder proof and text color: green oil white characters;
Surface treatment: immersion gold;
Aperture and tolerance:+- 0.1mm;
Continuous film mode: 1Panel=9Pcs;
Minimum line width/line spacing: 0.075mm/0.075mm
Size error: +-0.15mm
If you are interested in the HDI PCB above, welcome to contact with our sales and take orders.
