As shown in the figure above, packaging substrates are divided into three major categories: organic substrates, lead frame substrates, and ceramic substrates. The main function of a packaging substrate is to provide physical support for the chip, enabling electrical conductivity between the chip's internal and external circuits, as well as heat dissipation.
1. Organic substrate:
Including BT resin, FR4, etc., organic substrates have good flexibility and low cost.
2. Lead frame substrate:
A substrate made of metal, commonly used in traditional packaging, with good conductivity and mechanical strength.
3. Ceramic substrate:
Common materials include aluminum oxide and aluminum nitride, suitable for high-power chips.
In the next new, we will learn that which packaging methods are included for each of the three types of substrates.
