Today let’s continue to talk about the difference between aluminum base boards and FR-4 in thermal conductivity and mechanical strength.
Thermal Conductivity Differences:
Due to its metallic base, the aluminum baseboard has excellent heat dissipation properties. The thermal conductivity of aluminum is about 10 times that of FR-4, which means that the aluminum baseboard can more effectively conduct heat away from electronic components, making it ideal for high-power or high-heat load applications. This efficient heat dissipation capability makes the aluminum baseboard a preferred choice in fields that require rapid heat dissipation, such as LED lighting, power electronics, and automotive electronics.
Mechanical Strength Differences:
In terms of mechanical strength, the aluminum baseboard also shows advantages. Thanks to its metallic base, the overall mechanical strength and toughness of the aluminum baseboard are superior to FR-4. This allows the aluminum baseboard to better withstand the weight of large components and mechanical stresses during installation, and it is also suitable for making large-area PCB circuit boards. FR-4, as a glass fiber-reinforced epoxy resin material, also has certain mechanical strength, but it may not be as stable as the aluminum baseboard when facing heavy loads or frequent mechanical impacts.
In the next article, we will further analyze the differences between these two materials in terms of manufacturing difficulty, application range, and coefficient of thermal expansion.
