NEWS

Today, let’s talk about the other reason that determine how many layers a PCB is designed to have.

Today, we will continue to learn about the factors that determine how many layers a PCB is designed to have.

Today we are going to tell you what’s the meaning and what’s the importance of the “layer” in PCB manufacture.

Today, let's take a look at the testing instruments in our factory that provide quality assurance for the PCB products we produce.

On the 15th Oct. Our customer form NZ come to visit our factory in the ShenZhen.

Let’s continue to learn the the process about chip placement. 1. Pick-up Chips with Bump 2. Chip Orientation 3. Chip Alignment 4. Chip Bonding 5. Reflow 6. Washing 7. Underfilling 8. Molding

Let’s continue to learn the the process about creating bumps. 1. Wafer Incoming and Clean 2. PI-1 Litho: (First Layer Photolithography: Polyimide Coating Photolithography) 3. Ti / Cu Sputtering (UBM) 4. PR-1 Litho (Second Layer Photolithography: Photoresist Photolithography) 5. Sn-Ag Plating 6. PR Strip 7. UBM Etching 8. Reflow 9. Chip Placement

 In the previous news article, we introduced what flip chip is. So, what is the process flow of flip chip technology? In this news article, let's study in detail the specific process flow of flip chip technology.

Last time we mentioned the “flip chip” in the chip packaging technology table, then what is the flip chip technology? So let's learn that in today’s new.

Here are the table of Chip packaging corresponding substrate types

As shown in the figure above, packaging substrates are divided into three major categories: organic substrates, lead frame substrates, and ceramic substrates.

Today, I will tell you what is the meaning of TG, and what are the advantages of using high TG PCB.