We've already learned about the acceptance criteria for the soldermask process in all its aspects, so today let's learn about the inspection process for those working in the factory.
In the PCB solder resist production process, sometimes encounter ink off the case, the reason can basically be divided into the following three points.
Printed circuit board in the sun resistance welding process, is the screen printing after welding resistance of the printed circuit board with a photographic plate will be covered by the pad on the printed circuit board
In general, the solder mask thickness in the middle position of the line is generally not less than 10 microns, and the position on both sides of the line is generally not less than 5 microns, which used to be stipulated in the IPC standard, but now it is not required, and the specific requirements of the customer shall prevail.
The solder resistance film must have good film formation to ensure that it can be uniformly covered on the PCB wire and pad to form effective protection.
PCB solder mask can be displayed in different colors, including green, white, blue, black, red, yellow, matte, purple, chrysanthemum, bright green, matte black, matte green and so on.
