Product Overview
Engineered for high-power battery systems, this 18-layer heavy copper PCB integrates embedded copper coils and 2oz uniform copper layers to achieve 500A+ current capacity. Utilizing TG-170 high-Tg laminates with ENIG surface finish, it withstands 150°C operating temperatures while maintaining precise power conversion efficiency (≥98%). The 2.5mm robust structure ensures vibration resistance in harsh industrial environments
Product Features
1. Ultra-High Current Carrying Capacity
2oz inner/outer copper (70μm) with 70A continuous current per 1mm trace width, supporting 500A peak current transmission
2. Integrated Power Coil Design
Embedded spiral copper coils (min. 0.2mm spacing) reduce external wiring by 60%, improving power density by 3x
3. Thermal Stress Resistance
TG-170 substrate maintains structural stability at 170°C Tg, CTE <3% @260°C reflow
4. Multi-Layer Shielding
4 dedicated shielding layers suppress EMI to <30dBμV/m at 30MHz (per CISPR 32 Class B)
Arc Prevention Structure
1.5mm creepage distance design meets IEC 60664-1 Overvoltage Category III
Technical Specifications
| Layers | 18 |
| Material | High Tg FR-4 (TG-170) |
| Thickness | 2.5mm±0.1mm |
| Inner/Outer Copper Thickness | 2oz |
| Solder & Silkscreen | Green/White |
| Min. Line Width/Spacing | 0.2mm/0.2mm |
| Surface | ENIG |
Application Fields
1. Industrial battery management systems (BMS)
2. EV charging station power modules
3. Grid-scale energy storage converters
4. Industrial motor drives (500kW+)
5. Renewable energy inverters
6. High-current busbars & shunt resistors
Special Manufacturing Processes
1. Heavy Copper Plating
Step plating achieves 70μm copper thickness with <10% thickness variation
2. Embedded Coil Fabrication
Precise spiral etching (tolerance ±5%) with 20:1 aspect ratio copper walls
3. High-Pressure Lamination
Multi-stage lamination at 200°C/400psi prevents resin voids (<1%)
4. Thermal Management Design
12 thermal vias/cm² under power components, Rθja <5°C/W
5. Step Slot Cutting
CNC-machined slots create 1.5mm creepage barriers (accuracy ±0.05mm)
Product Summary
This 18-layer heavy copper PCB revolutionizes power transfer for mega-watt battery systems through monolithic copper coil integration and multi-layer thermal diffusion technology. Capable of handling 2000A/mm² current density with <2% voltage drop, it eliminates traditional busbar limitations while providing 50kV isolation protection. The robust TG-170 base material ensures 100,000+ power cycles at full load, making it the ultimate solution for next-generation energy infrastructure.
Sanxis Tech, is a trusted PCB manufacturer with over 20 years of experience. Our products, including double-sided, multi-layer, HDI, flex-rigid boards, and more, are widely used in high-tech fields like automotive, medical, and industrial control. Equipped with state-of-the-art machinery and advanced testing facilities, we ensure top-quality output. Our certifications from RoHS, UL, ISO9001, and other organizations further guarantee reliability. Choose Sanxis Tech for quality and innovation.
