Company News

Company News
  • As we all know that, With the rapid development of communication and electronic products, the design of printed circuit boards as carrier substrates is also moving towards higher levels and higher density. High multi-layer backplanes or motherboards with more layers, thicker board thickness, smaller hole diameters, and denser wiring will have greater demand in the context of the continuous development of information technology, which will inevitably bring greater challenges to the PCB-related processing processes.

    2024-10-28

  • Mobile PCB are one of the most critical components inside a mobile phone, responsible for power and signal transmission as well as the connection and communication between different modules.

    2024-10-27

  • Today, let's explore how to test SMT stencils. The quality inspection of SMT stencil templates is mainly divided into the following four steps

    2024-10-26

  • Today we will continue to learn about the last method of manufacturing PCB SMT stencils: Hybrid process.

    2024-10-25

  • Today we will continue to learn about the third method of manufacturing PCB SMT stencils: Electroforming.

    2024-10-25

  • Today we will continue to learn about the second method of manufacturing PCB SMT stencils: Laser Cutting. Laser cutting is currently the most popular method for manufacturing SMT stencils. In the SMT pick-and-place processing industry, more than 95% of manufacturers, including us, use laser cutting for stencil production.

    2024-10-25

  • Today, we will continue to explore the three methods of manufacturing PCB SMT stencils: Chemical Etching (Chemical Etching Stencil), Laser Cutting (Laser Cutting Stencil), and Electroforming (Electroformed Stencil). Let's start form chemical etching.

    2024-10-24

  • Today, we will discuss how to choose the thickness and design the apertures when using SMT stencils.

    2024-10-24

  • Today we will learn about some special SMT PCB components and the Requirements for the shape and size of the apertures on the glue printing stencil.

    2024-10-24

  • Let’s continue to learn about the design requirements for the fabrication of SMT stencils. The general factory can accept the following three types of document formats for stencil making In addition, the materials we require from customers for making templates generally include the following layers The aperture design of the stencil should consider the demolding of the solder paste, which is mainly determined by the following three factors

    2024-10-23

  • Now let’s learn about the design requirements for the fabrication of SMT stencils. 1. General Principle 2. Stencil (SMT template) aperture design tips 3. Documentation preparation before SMT stencil template design

    2024-10-23

  • The SMT stencil manufacturing process specification includes several critical components and steps to ensure the quality and accuracy of the stencil. Now let’s learn about the key elements involved in the production of SMT stencils: 1. Frame 2. Mesh 3. Stencil Sheet 4. Adhesive 5. Stencil Making Process 6. Stencil Design 7. Stencil Tension 8. Mark Points 9. Stencil Thickness Selection

    2024-10-23