Company News

As the number of layers in multilayer printed circuit boards increases, beyond the fourth and sixth layers, more conductive copper layers and dielectric material layers are added to the stack-up.

A 6-layer PCB is essentially a 4-layer board with the addition of 2 extra signal layers between the planes.

Today, we continue to discuss multilayer PCB, the four-layer PCB

In this new, we will learn about the knowledge of single-layer PCB and double-sided PCB.

Today, let’s talk about the other reason that determine how many layers a PCB is designed to have.

Today, we will continue to learn about the factors that determine how many layers a PCB is designed to have.

Today we are going to tell you what’s the meaning and what’s the importance of the “layer” in PCB manufacture.

Today, let's take a look at the testing instruments in our factory that provide quality assurance for the PCB products we produce.

On the 15th Oct. Our customer form NZ come to visit our factory in the ShenZhen.

Let’s continue to learn the the process about chip placement. 1. Pick-up Chips with Bump 2. Chip Orientation 3. Chip Alignment 4. Chip Bonding 5. Reflow 6. Washing 7. Underfilling 8. Molding

Let’s continue to learn the the process about creating bumps. 1. Wafer Incoming and Clean 2. PI-1 Litho: (First Layer Photolithography: Polyimide Coating Photolithography) 3. Ti / Cu Sputtering (UBM) 4. PR-1 Litho (Second Layer Photolithography: Photoresist Photolithography) 5. Sn-Ag Plating 6. PR Strip 7. UBM Etching 8. Reflow 9. Chip Placement

 In the previous news article, we introduced what flip chip is. So, what is the process flow of flip chip technology? In this news article, let's study in detail the specific process flow of flip chip technology.