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With the development of science and technology, information and communication technology is changing day by day, people's performance requirements for computers are getting higher and higher.

The main PCB supply chain has recently benefited from the demand for new product preparation.

As the demand for high-performance computing grows, the semiconductor industry is exploring new materials to enhance the speed and efficiency of chip integration.

In the context of semiconductor packaging, glass substrates are emerging as a key material and a new hotspot in the industry. Companies like NVIDIA, Intel, Samsung, AMD, and Apple are reportedly adopting or exploring glass substrate chip packaging technologies.

Today, let’s continue to learn the statistical problems and solutions of solder mask manufacture.

In the PCB solder mask process, sometimes we will have some production problems, today we will be part of the statistical problems and solutions for reference.

Paste mask. It is used for the SMT (Surface-Mount Technology) placement machine to place components. The template of the paste mask corresponds to the pads of all surface-mounted components, and its size is the same as the top and bottom layers of the board.

What are The Benefits of Using Solder Mask to Plug Holes?

We've already learned about the acceptance criteria for the soldermask process in all its aspects, so today let's learn about the inspection process for those working in the factory.

Following up on the last news, this news article continues to learn the acceptance criteria for the quality of PCB solder mask process.

Following up on the last news, this news article continues to learn the acceptance criteria for the quality of PCB solder mask process.

Today we will learn that, in the PCB solder mask, specifically should be in accordance with which standards to process.