The 10-Layer HDI (High-Density Interconnect) High-Frequency & High-Speed Optical Module Test PCB is a cutting-edge solution designed for precision testing of optical communication modules. Tailored for R&D validation, production line testing, and quality assurance, this PCB ensures ultra-low signal loss and exceptional signal integrity in high-speed data transmission scenarios (25Gbps to 56Gbps PAM4).
The 10-Layer HDI (High-Density Interconnect) High-Frequency & High-Speed Optical Module Test PCB is a cutting-edge solution designed for precision testing of optical communication modules. Tailored for R&D validation, production line testing, and quality assurance, this PCB ensures ultra-low signal loss and exceptional signal integrity in high-speed data transmission scenarios (25Gbps to 56Gbps PAM4). Its advanced architecture supports rigorous performance evaluation of optical modules under extreme conditions, including high-frequency signal jitter analysis, eye diagram validation, and protocol compliance testing. Compatible with industry standards such as IEEE 802.3 and ITU-T G.957, this PCB is a cornerstone for next-generation 5G networks, hyperscale data centers, and fiber-optic communication systems.
HDI Technology with Any-Layer Interconnects
Leveraging 10-layer stacking and micro-blind vias (0.15mm diameter), this PCB achieves a wiring density 40% higher than conventional designs. Laser-drilled microvias (±15μm precision) and staggered via patterns minimize signal path length, enabling rise times below 35ps for high-frequency applications.
High-Frequency Optimized Material
Constructed with low-loss FR-4 substrate (Dk=4.2@1GHz, Df=0.015), this PCB reduces signal attenuation to <0.3dB/inch at 10GHz. Differential pair routing with ±5% impedance control ensures phase consistency for 56Gbps PAM4 signals.
Precision Manufacturing Processes
Laser Drilling & Plasma Desmear: Achieves via wall roughness (Ra<1.5μm) and eliminates dielectric contamination.
OSP Surface Finish: Provides a 0.2-0.5μm oxidation-resistant layer, supporting lead-free soldering (260°C peak temperature).
EMI/EMC Mitigation
Integrated ground via arrays and shielding layers suppress electromagnetic interference (EMI) to below -50dBm, meeting CISPR 32 Class B standards for noise-sensitive test environments.
Mechanical Durability
Resin-filled blind vias and 1.6mm board thickness enhance flexural strength (>50N/mm²), ensuring reliability in high-vibration industrial settings.
| Layers | 10 |
| Material | High-Frequency FR-4 |
| Thickness | 1.6mm |
| Inner/Outer Copper Thickness | 0.5oz/2oz |
| Solder & Silkscreen | Green/White |
| Min. Line Width/Spacing | 6/7mil (0.15/0.18mm) |
| Surface | OSP |
5G Base Station Testing
Validates 25G/50G NRZ and 56G/112G PAM4 optical transceivers for signal integrity and jitter tolerance.
Data Center Interconnects
Supports 400G/800G DR4/FR4 optical module compatibility testing and thermal cycling evaluations.
Coherent Optical Communication R&D
Enables DSP algorithm debugging and nonlinear distortion analysis for CFP2-DCO modules.
Automated Test Equipment (ATE)
Integrates with high-throughput test systems for batch production quality control.
Blind Via Fabrication
Depth-controlled laser drilling creates blind vias (aspect ratio 8:1) to eliminate signal reflections, maintaining impedance stability (±5%) for 56Gbps+ transmission.
Resin Plugging Technology
Low-CTE epoxy resin (CTE<50ppm/℃) fills vias under vacuum, achieving surface flatness <5μm and reducing insertion loss to <0.02dB per via.
The 10-Layer HDI High-Frequency & High-Speed Optical Module Test PCB is engineered to meet the stringent demands of modern optical communication testing. Combining HDI technology, low-loss materials, and precision manufacturing, it ensures minimal signal distortion and robust performance in high-speed environments up to 56Gbps PAM4. Critical applications span 5G base station validation, data center interoperability testing, and advanced R&D for coherent optical modules. With features like OSP surface finish for solderability, EMI-resistant shielding, and mechanical durability, this PCB delivers unmatched reliability for both laboratory and industrial test platforms. Its compliance with international standards guarantees seamless integration into global communication infrastructure, driving innovation in high-speed optical networks.
Sanxis Tech, is a trusted PCB manufacturer with over 20 years of experience. Our products, including double-sided, multi-layer, HDI, flex-rigid boards, and more, are widely used in high-tech fields like automotive, medical, and industrial control. Equipped with state-of-the-art machinery and advanced testing facilities, we ensure top-quality output. Our certifications from RoHS, UL, ISO9001, and other organizations further guarantee reliability. Choose Sanxis Tech for quality and innovation.
