Designed for space-constrained high-performance applications, this 4-layer ultra-thin PCB enables 10Gbps+ signal transmission in micro-electronics. Utilizing TG-170 FR4 substrate with ENIG finish, it supports BGA/CSP processors down to 0.35mm pitch. The 0.8mm rigid structure maintains 0.13mm precision circuitry while resisting thermal deformation during reflow.
Product Overview
Designed for space-constrained high-performance applications, this 4-layer ultra-thin PCB enables 10Gbps+ signal transmission in micro-electronics. Utilizing TG-170 FR4 substrate with ENIG finish, it supports BGA/CSP processors down to 0.35mm pitch. The 0.8mm rigid structure maintains 0.13mm precision circuitry while resisting thermal deformation during reflow.
Product Features
1. Micro-Scale Integration
0.13mm/0.13mm trace capability enables 50% size reduction vs. standard designs.
2. High-Frequency Optimization
Controlled 50Ω±5% impedance with <0.5dB insertion loss @5GHz.
3. Enhanced Thermal Management
24 thermal vias/cm² under processors (0.5mm±0.08mm), θJA <15°C/W.
4. Assembly-Friendly Design
4-layer symmetrical stackup prevents warpage (<0.7% @260°C).
5. EMC-Ready Architecture
Continuous ground planes suppress EMI >25dB @1GHz.
Technical Specifications
| Layers | 4 |
| Material | High Tg FR-4 (TG-170) |
| Thickness | 0.8mm±0.1mm |
| Inner/Outer Copper Thickness | 1oz |
| Solder & Silkscreen | Green/White |
| Min. Line Width/Spacing | 0.13mm/0.13mm |
|
Min. Drilled Hole |
0.5mm±0.08mm |
| Surface | ENIG |
Application Fields
1. Wearable computing modules.
2. IoT gateway processors.
3. Mini-PC mainboards.
4. Industrial sensor controllers.
5. Satellite communication subsystems.
6. Micro-robotics control units.
Special Manufacturing Processes
1. Laser Direct Imaging (LDI)
S±5μm alignment accuracy for 0.13mm traces with <10% etch variation
2. Multi-Stage Lamination
Low-pressure press (15psi) at 180°C prevents thin-board delamination
3. Step Drilling Technology
0.5mm holes with ±0.08mm positional accuracy (IPC-A-600 Class 3)
4. Micro-via Filling
100% conductive epoxy filling for planar surface topology
5. Automated Optical Inspection (AOI)
10μm defect detection resolution with neural network algorithm
Product Summary
This 4-layer micro-PCB delivers full-featured processing power in footprint-critical applications. The TG-170 core material withstands 5× lead-free reflow cycles at 260°C, while 0.13mm circuitry enables direct mounting of 0.3mm pitch BGA packages. With propagation delay controlled within ±15ps/inch, it's the optimal solution for next-gen edge computing devices requiring complex functionality in <25mm² area.his 18-layer heavy copper PCB revolutionizes power transfer for mega-watt battery systems through monolithic copper coil integration and multi-layer thermal diffusion technology. Capable of handling 2000A/mm² current density with <2% voltage drop, it eliminates traditional busbar limitations while providing 50kV isolation protection. The robust TG-170 base material ensures 100,000+ power cycles at full load, making it the ultimate solution for next-generation energy infrastructure.
Sanxis Tech, is a trusted PCB manufacturer with over 20 years of experience. Our products, including double-sided, multi-layer, HDI, flex-rigid boards, and more, are widely used in high-tech fields like automotive, medical, and industrial control. Equipped with state-of-the-art machinery and advanced testing facilities, we ensure top-quality output. Our certifications from RoHS, UL, ISO9001, and other organizations further guarantee reliability. Choose Sanxis Tech for quality and innovation.
