This 14-layer multilayer PCB is engineered for high-performance server data transmission. Utilizing Rogers F408HR high-frequency substrate with ENIG surface finish and copper-filled via technology, it achieves 40Gbps+ signal transmission. With 1.88mm precision thickness and 0.15mm/0.15mm ultra-fine circuitry, it meets rigorous demands for signal integrity, thermal management, and space density in data center equipment.
Product Overview
This 14-layer multilayer PCB is engineered for high-performance server data transmission. Utilizing Rogers F408HR high-frequency substrate with ENIG surface finish and copper-filled via technology, it achieves 40Gbps+ signal transmission. With 1.88mm precision thickness and 0.15mm/0.15mm ultra-fine circuitry, it meets rigorous demands for signal integrity, thermal management, and space density in data center equipment.
Product Features
1. Almost-Zero Signal Loss
F408HR substrate (Dk=3.3±0.05@10GHz) ensures ≤0.2dB/cm attenuation up to 40GHz, compliant with PCIe 5.0/USB4 protocols
2. Enhanced Reliability via Copper Filling
Conductive copper paste filling (resistivity ≤5μΩ·cm) improves thermal cycling performance (1,000 cycles at -55℃~125℃)
3. Ultra-Precision Circuitry
0.15mm/0.15mm line width/spacing supports 0.35mm BGA pitch components with wiring density up to 120cm/cm²
4. Uniform Copper Thickness
1oz inner/outer layers (±10% tolerance) minimize impedance discontinuity (≤5% variation), ensuring 28Gbps+ signal integrity
5. Advanced EMI Shielding
Triple ground layers + copper-filled vias create Faraday cage structure with >30dB EMI suppression @10GHz
Technical Specifications
| Layers | 14 |
| Material | Rogers F408HR High-Frequency Laminate |
| Thickness | 1.88±0.1mm |
| Inner/Outer Copper Thickness | 1oz |
| Solder & Silkscreen | Blue/White |
| Min. Line Width/Spacing | 6/6mil (0.15mm/0.15mm) |
| Surface | ENIG |
Application Fields
1. Server motherboard high-speed interconnects
2. Data center switch backplanes
3. AI accelerator card signal layers
4. 5G base station baseband processing units
5. High-speed storage devices (NVMe SSD arrays)
Special Manufacturing Processes
1. Precision Lamination Control
Ultra-low flow prepreg (TU-662) with ±25μm layer alignment and <3% Z-axis expansion
2. Laser Microvia Drilling
CO₂ laser + UV drilling for 0.2mm microvias (15:1 aspect ratio), ±20μm positional accuracy
3. Copper Via Filling Process
Vacuum-pressure filled conductive copper paste (>85% Cu content), <5% voiding, >80W/(m·K) thermal conductivity
4. Hybrid Impedance Control
100Ω differential impedance tolerance ±7%, compliant with IEEE 802.3bj standard
Product Summary
This 14-layer ENIG copper-filled via PCB solves critical GHz-level signal attenuation and thermal stress failures in servers through high-frequency material selection and 3D interconnection technology. Copper-filled vias reduce thermal resistance by 40%, while 0.15mm ultra-fine circuits provide a high-reliability platform for next-gen 200G/400G data center equipment, enabling breakthrough transmission bandwidth.
Sanxis Tech, is a trusted PCB manufacturer with over 20 years of experience. Our products, including double-sided, multi-layer, HDI, flex-rigid boards, and more, are widely used in high-tech fields like automotive, medical, and industrial control. Equipped with state-of-the-art machinery and advanced testing facilities, we ensure top-quality output. Our certifications from RoHS, UL, ISO9001, and other organizations further guarantee reliability. Choose Sanxis Tech for quality and innovation.
